Wolfspeed to Purchase AIXTRON Epitaxial Tools to Ramp 200mm Production
Silicon Carbide Planetary Reactor(R) technology meets higher performance requirements of Silicon Carbide power electronics
Herzogenrath/Germany March 14, 2022 - AIXTRON SE (FSE: AIXA) announced today that Wolfspeed, Inc. (NYSE: WOLF) will deploy its 200mm Planetary Reactor(R) technology in the manufacturing of Silicon Carbide (SiC) based MOSFET and Schottky diode power devices at its production facilities.
"Silicon Carbide is one of the key next-generation power management technologies. It allows us to write a new, highly exciting chapter in the development of the semiconductor industry and make an important contribution to energy-efficient technologies that support a sustainable future. Wolfspeed is at the forefront of 200mm Silicon Carbide production and we are proud to be working with Wolfspeed to help bring this latest innovation to market," said Dr. Felix Grawert, President and CEO of AIXTRON SE, a leading manufacturer of deposition equipment for the semiconductor industry.
The new Planetary Reactors(R) will be delivered in a 6x200mm configuration, the largest capacity available to the market to date for Silicon Carbide epitaxy, representing a significant increase in total epitaxy area per batch compared to existing planetary systems. The product will be highly automated enabling rapid exchange of parts without interfering with production cycles. The tools will also have temperature control technology for best on-wafer performance to match the leading-edge quality requirements for the epitaxial layers on Silicon Carbide wafers.
"The demand for Silicon Carbide solutions continues to accelerate, primarily driven by the automotive, industrial and energy applications as they shift from Silicon to Silicon Carbide technology. Wolfspeed continues to make investments to increase capacity and capitalize on the benefits of Silicon Carbide to help deliver a greater supply to the market," said Wolfspeed CEO Gregg Lowe. "We appreciate our long-term, outstanding relationship with AIXTRON. They are an important partner as we ramp production in the world's first 200mm Silicon Carbide fabrication facility," added Gregg Lowe, CEO of Wolfspeed.
Wolfspeed is the global leader in Silicon Carbide technology and is currently ramping production in an automated 200mm Silicon Carbide wafer fab in Marcy, Mohawk Valley, New York. Because of its unique physical properties, Silicon Carbide enables high power density and energy efficiency and will drive the next generation of semiconductor technology.
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AIXTRON SE is a leading provider of deposition equipment to the semiconductor industry. The Company was founded in 1983 and is headquartered in Herzogenrath (near Aachen), Germany, with subsidiaries and sales offices in Asia, United States and in Europe. AIXTRON's technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and optoelectronic applications based on compound semiconductor materials. Such components are used in a broad range of innovative applications, technologies, and industries. These include Laser and LED applications, display technologies, data transmission, SiC and GaN power management and conversion, communication, signaling and lighting as well as a range of other leading-edge applications.
Our registered trademarks: AIXACT(R), AIXTRON(R), Close Coupled Showerhead(R), EXP(R), EPISON(R), Gas Foil Rotation(R), Optacap(R), OVPD(R), Planetary Reactor(R), PVPD(R), STexS(R), TriJet(R)
For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6) please visit our website at: www.aixtron.com
This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON. These statements may be identified by words such as "may", "will", "expect", "anticipate", "contemplate", "intend", "plan", "believe", "continue" and "estimate" and variations of such words or similar expressions. These forward-looking statements are based on our current assessments, expectations and assumptions, of which many are beyond control of AIXTRON, and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize, or should underlying expectations not occur or assumptions prove incorrect, actual results, performance or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semi-conductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements , in particular in the chapter Risks in the Annual Report, filed by AIXTRON. Any forward-looking statements contained in this document are based on current expectations and projections of the executive board based on information available the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law.
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