!!! Press Release !!!

AIXTRON AG (FSE:AIX) and Kopin Corporation (NASDAQ:KOPN), today announced that Kopin Corporation has signed a multi-year agreement to purchase multiple AIXTRON high volume reactors. The systems will support the production of Kopin’s advanced gallium arsenide (GaAs) heterojunction bipolar transistor (HBT) device wafers. Two systems, one AIX 2400 and an AIX 2600, will be delivered to Kopin in 1999.

"AIXTRON’s 2600 production system was developed to support major commercial programs such as Kopin’s, stated Dr. Holger Juergensen, AIXTRON President and CEO. "Kopin selected the AIX 2600 MOCVD production system for its reliability, throughput, uniformity and low cost of ownership. This second contract from the world’s leading merchant supplier of HBT device wafers demonstrates the satisfaction of this very demanding customer, and the leadership of our technology and services."

Kopin’s investment in increased capacity, its second in two years, is driven by growing customer demand for its HBT device wafers, a key component in the production of high performance integrated circuits used in advanced digital cellular phones, high speed SONET networks and other communication devices. Kopin chose AIX 2600G3 series systems to compliment its existing AIX 2400 reactor systems, which are already in high volume production. These systems will support Kopin’s cost reduction programs and increase the company’s six inch wafer capacity.

"We are pleased to continue our strong working relationship with AIXTRON during our next production expansion," said Dr. John C. C. Fan, Kopin President and CEO. "Our manufacturing teams and our customers require the best, state-of-the-art platform for the development and production of advanced HBT device wafers and other structures. With the acquisition of these two systems in 1999, we have accomplished our goal of doubling our capacity."

The AIX 2400 is a well-proven production system and can hold five four-inch wafers in one deposition run. The AIX 2600G3 has a flexible design for five six-inch, or eight four-inch wafers in one deposition run. The G3 design includes the automated wafer-handling tool which will provide lower cycle times and allows full cassettes of wafers to be used without operator assistance. AIXTRON offers a wide range of epitaxial systems for MOVPE, VPE and LPE from R&D-oriented systems up to large-scale Planetary Reactorâ production systems for up to 25x4-inch or 9x6-inch wafers. The company has installed over 280 systems worldwide, provides an extensive service and support network for maintenance and upgrading and is represented in over 15 countries.

Kopin is a leading developer and manufacturer of high resolution, flat panel display products and Wafer-Engineered™ device wafers for telecommunications and digital imaging applications. Founded in 1984 with initial technology developed at Massachusetts Institute of Technology, Kopin holds over 125 patents and patent applications for technological breakthroughs in flat panel display and HBT device wafer technology. These technologies have enabled Kopin to market display products and device wafers that enhance the delivery and presentation of video, voice and data. The Company has combined advanced AMLCD and integrated circuit technology to produce its CyberDisplay family of ultra-small, high density imaging devices. Telecommunication providers are using Kopin’s device wafers for high-performance integrated circuits used primarily in advanced cellular phones and other communications devices. For more information, please visit Kopin’s website at http://www.kopin.com.

Wafer-Engineering, Wafer-Engineered and CyberDisplay are trademarks of Kopin Corporation.

Forward-looking statements contained in this press release are made under "safe harbor" provisions of the Private Securities Litigation Reform Act of 1995 and involve a number of risks and uncertainties that could materially affect future results. Among these risk factors are general economic and business conditions and growth in the flat panel display and gallium arsenide integrated circuit and materials industries, the impact of competitive products and pricing, availability of third-party components, availability of integrated circuit fabrication facilities, cost and yields associated with production of the Company’s CyberDisplay imaging devices and Wafer-Engineered device wafers, loss of significant customers, acceptance of the Company’s products, continuation of strategic relationships, year 2000 matters, and the other risk factors and cautionary statements listed from time to time in the Company’s periodic reports and registration statements filed with the Securities and Exchange Commission, including but not limited to, the Company’s Annual Report on Form 10-K for the fiscal year ended December 31, 1997.

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© AIXTRON AG February 1999

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