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!!! Press Release
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AIXTRON joins
IMEC's high-k/metal gate program
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Aachen
/ Leuven, Belgium, March 11 ,
2004, - Today AIXTRON AG, the German equipment supplier announced that
they will install a 200/300 mm multi- chamber
Tricent
platform in IMEC's 300 mm clean room for Atomic Vapor Deposition
(AVD ) of
advanced CMOS gate stacks joining at the same time IMEC's sub-45
nm research platform as an equipment partner.
Sub-45
nm process technologies will require novel materials and innovative deposition
solutions to stay at the forefront of the semiconductor technology roadmap.
This is particularly true for the transistor gate stack where many top
IC manufactures are putting in substantial effort to overcome the hurdles
limiting the realization of future device scaling. IMEC's collaborative
sub-45 nm research program on high-k oxides and metal electrodes, targets
future transistor generations two to three nodes ahead of today's state-of-the-art
IC production.
In the framework of
this program, AIXTRON announced that they have entered into a 3-year
Joint Development Program (JDP) with IMEC using AVD
for deposition of novel materials for high-k and metal gate stacks for
the next generation of scaled transistor concepts. Both dual and single
metal gate options will be pursued. This new partnership will be an integral
part of IMEC's sub-45 nm research platform conducted in close co-operation
with many of the top IC manufacturers worldwide.
Major
milestones of this high-k/metal gate joint development program will include:
- Implementation
of multi-component high-k dielectrics with polysilicon / fully silicided
gate electrodes in planar devices aiming at EOT values in the order
of 1-1.5 nm.
- Development of
alternative multi-component metal oxides with higher k values (k ~ 25-50)
for future scaling needs requiring EOT's down to 0.5 nm.
- Development of
optimized metal layers for implementation as dual or single metal gates
in aggressively scaled devices.
- Exploration of
the limits of scaling planar CMOS devices with metal electrodes targeting
a 20 nm gate length and EOT values down to 0.5 nm.
- Deposition of advanced
high-k/metal gate stacks on Germanium substrates.
In
conjunction with this project, AIXTRON will install a Tricent
200/300 mm CMOS cluster platform specifically tailored for sub-70 nm technology
nodes in IMEC's new 300 mm clean room. This Tricent
platform features an Atomic Vapor Deposition (AVD )
module for gate dielectrics deposition e.g. HfSixOy, and a metal AVD
module for the deposition of advanced electrode materials e.g. Ru, TiN,
and Ta(Si)N. AIXTRON's patented proprietary AVD
technology enables atomic scale thickness control, while achieving high
deposition rates, by utilizing the unique TRIJET
pulsed precursor injection source. This proprietary technology allows
for the simultaneous injection of precursor chemistries, providing outstanding
control of the deposition of multi-component materials. Also included
in this cluster will be a rapid thermal annealing module, including plasma
nitridation and oxidation features, which will ensure flexible pre- and
post-deposition interface engineering capability.
"AIXTRON's
flexible MOCVD technology allows a broad assessment of several material
candidates which will enhance our high-k/metal gate research," said Professor
Gilbert Declerck, President and CEO of IMEC. "Additionally, AIXTRON's
20 years expertise in III/V equipment and process technology certifies
AIXTRON also as key partner in the framework of IMEC's program on Germanium-based
CMOS devices. We see this collaboration as a first step towards a more
elaborated collaboration in the area of Germanium-based devices for which
profound deposition expertise of III/V materials is absolutely crucial."
"This
agreement represents an important step forward in further strengthening
AIXTRON's position for providing enabling deposition solutions for these
emerging semiconductor applications. By forging this partnership with
one of the top research organizations in the industry, like IMEC, AIXTRON
will remain at the forefront of cutting edge enabling MOCVD process technology
development, building on its 20-year history of delivering complex material
solutions to the high tech industry. We have been highly impressed by
the professionalism and the technical competencies of the IMEC team, and
look forward to combining our knowledge and experience to develop solutions
to address these new material challenges. Equally, this program represents
an important complementary effort to AIXTRON's on-going high-k development
activities within the MEDEA T207 program at STMicroelectronics in Crolles
(F)" said Tim McEntee, Executive Vice President and COO Semiconductor
Equipment of AIXTRON AG.
About
IMEC
IMEC
is a world leading independent research center in nanoelectronics and
nanotechnology. Its research focuses on the next-generation of chips and
systems, and on the enabling technologies for ambient intelligence. IMEC's
research bridges the gap between fundamental research at universities
and technology development in industry. Its unique balance of processing
and system know-how, intellectual property portfolio, state-of-the-art
infrastructure and a strong network of companies, universities and research
institutes worldwide, positions IMEC as a key partner with which to develop
and improve technologies for future systems. IMEC is headquartered in
Leuven, Belgium and has representatives in the US, China and Japan. Its
staff of more than 1300 people includes over 380 industrial residents
and guest researchers. In 2003, its revenues were EUR 145 million. Further
information on IMEC can be found on www.imec.be.
About
AIXTRON AG
AIXTRON
is, as verified by an independent market research institute, the world
leading supplier of equipment for semiconductor epitaxy. Its equipment
is used by a diverse range of customers worldwide to manufacture critical,
advanced components such as HBTs, PHEMTs, MESFETs, Lasers, LEDs, Detectors
and VCSELs used in fiber optic communication systems, wireless and mobile
telephony applications, optical storage devices, illumination, signaling
and lighting, as well as a range of other leading edge technologies. Originally
focusing on compound semiconductor applications over the last years AIXTRON
has broadened it's product portfolio to enabling MOCVD Technologies for
advanced materials for next generations of main stream semiconductor devises
and Organic LED applications. To date, AIXTRON's total installed base
of systems exceeds 800 tools worldwide. AIXTRON AG (FSE: AIX ISIN DE0005066203)
is listed in the Prime Standard and Tec-DAX of the German Stock Exchange
(Deutsche Börse) and is included in the MSCI World Index. Please visit
our website at www.aixtron.com for further information.
For further information please contact:
Investor
Relations and Corporate Communications
AIXTRON AG
Kackertstr. 15 - 17
D-52072 Aachen, Germany
Phone:+49 241 8909 444
Fax: +49 241 8909 445
E-mail: invest@aixtron.com |
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© AIXTRON AG, March
11 , 2004
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