|
Silicon Semiconductors
AIXTRON’s semiconductor product portfolio offers Atomic Layer Deposition (ALD), Atomic Vapor Deposition (AVD) and Chemical Vapor Deposition (CVD) systems with cutting-edge technology for Logic, DRAM, eDRAM, Flash, MIM and Thin Film Head applications. Customer may choose from several system configurations of AIXTRON or Genus.
 Comparison between ALD, AVD and CVD
|
Benefits - Production proven platform
- Exceptional film quality and uniformity
- High productivity with lower CoO
- High availability in high volume manufacturing
- Ease-of-use maintenance and serviceability
- Extendible to 32nm technology and beyond
Applications - High productivity ALD films with excellent conformality
in high AR DRAM structures
- High throughput high-k Gate Dielectrics
- Gate Metals with band-edge work functions
- Multicomponent films (PZT, SBT and GST) for FeRAM and PRAM
- High quality high-k films for Flash, RF MIM and eDRAM
- Conformal ALD film for Thin Films Head
|
The term AVD® is a registered trademark.
|
 |
|
German Version
