Key Benefits of OVPD Technology

Productivity

• High throughput due to high deposition rates
• Scalability based on proprietary Close Coupled Showerhead (CCS) Technology
• Gen1, Gen2 motherglass size equipment available
• Ongoing scaling towards future market requirements

Low Running Cost (CoO)

• High organic material utilization (> 50%)
• External source configuration = low maintenance
• Heated deposition chamber = low maintenance

High Yield

• Stable and reproducible deposition rates
• Precise control of multi-layer device fabrication
• Excellent uniformity
• High material quality
• Precision control of layer composition (co-hosting/-doping)
• High resolution patterning for full color display by precision mask alignment (qualified in LCD industry)
• Active temperature control of substrate and shadow mask
• Particle management
• Minimized condensation on chamber walls
• No moving parts inside deposition chamber

Flexibility

• Flexible Cluster Tool or In-Line Architecture
• SEMI/MESC Standard
• Enabling Superior Novel Device Structures

Advanced Control

• Fully computerized process control
• Easy transfer of production process from system to system

Contact

The term OVPD^® is a registered trademark.